Thickness range: PI:5mics to 25mics Cu:3mics to 100mics
Material: PI+Cu
Conductivity:Cu surface resistance ≤ 0.5 Ω/sq (can reach 0.2 Ω/sq)
Heat resistance: 260℃
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Parameter Category |
Specific Project |
Description |
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Structural Composition |
Basic Structure |
Polyimide (PI) Substrate Conductive Copper Layer |
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Product Variant |
Single-sided copper plating, double-sided copper plating |
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Physical Properties |
THK |
PI:5mics to 25mics Cu:3mics to 100mics |
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WIDTH |
450mm to 1500mm |
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Performance Indicators |
Conductivity |
Cu surface resistance ≤ 0.5 Ω/sq (can reach 0.2 Ω/sq) |
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Cohesion |
Coating adhesion ≥5B (ASTM D3359 standard) |
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Heat resistance |
With long-term heat resistance of 120°C, the PI substrate can withstand high temperatures up to 260°C. |
Packaging of Copper-plated Polyimide Film
Shanghai Mac Products are packed and labeled according to the regulations and customer's requests. Great care is taken to avoid any damage which might be caused during storage or transportation. In addition, clear labels are tagged on the outside of the packages for easy identification of the product I. D. and quality information.
1) Shanghai Mac Standard
2) Customization

