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Diamond Wire
Stone‑cutting Diamond Wire: Diameter 0.40‑0.80 mm
Magnetic‑material Diamond Wire: Diameter 0.14‑0.25 mm
Spool Length for Stone Grade: 20000‑40000 m per spool
Spool Length for Magnetic‑material Grade: 20000‑60000 m per spool
Shanghai Mac Corporation is a Diamond wire manufacturer and supplier.
Diamond wires are high-precision functional linear cutting components essential in the fields of photovoltaic new energy, semiconductor processing, sapphire processing, hard and brittle material cutting, and precision optical manufacturing. They are fabricated with high-strength high-carbon steel wire as the base material, through surface pretreatment, ultra-fine diamond abrasive coating, electroplating/resin bonding and precision finishing processes, forming linear cutting tools with ultra-high hardness, high wear resistance, high tensile strength and stable cutting performance. The diameter ranges from 0.14 millimeters to 0.8 millimeters. These professional wires undertake core precision cutting and processing functions in multiple industries, including slicing monocrystalline silicon, polycrystalline silicon and perovskite silicon wafers for photovoltaic cells, cutting and shaping semiconductor silicon wafers, sapphire substrates and ceramic chips, processing precision optical glass and crystal materials, realizing ultra-thin slicing and low-damage cutting of various hard and brittle new materials, and meeting the requirements of high efficiency, low loss, high flatness and high yield in precision machining, while maintaining excellent dimensional stability and long-service performance in continuous high-intensity working environments.
If you want to know more about our Diamond wire price please feel free to contact us, we will reply you within 24 hours.
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3. Density: 7.85–7.90g/cm³ (Carbon steel substrate: 7.85g/cm³; Diamond coated finished wire: 7.88–7.90g/cm³)
4.Melting Point: Approximately 1450℃ (Steel substrate: about 1450℃; Synthetic diamond abrasive: above 3500℃)
5.Tensile Strength: 3500–4500MPa (Ultra-high strength substrate, stable tension for long-term cutting operation)
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1. High Tensile‑Breaking Resistance
Maintains stable mechanical strength under continuous high‑speed tension; reduces unexpected wire breakage and unplanned production downtime.
2. Controlled Kerf Loss Performance
Produces narrow cutting gap during slicing; raises raw‑material utilization rate and lowers material waste for high‑value brittle ingots.
3. Consistent Abrasive Bonding Stability
Fixes diamond grits firmly onto steel substrate; prevents premature grit shedding during long‑cycle cutting and extends usable service life.
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|
Stone Special Diamond Wire |
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|
Finished wire diameter |
Breaking force |
|
φ0.40 +0.03 mm |
235 |
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φ0.45 +0.03 mm |
325 |
|
φ0.50 +0.03 mm |
385 |
|
φ0.55 +0.03 mm |
405 |
|
φ0.60 +0.03 mm |
500 |
|
φ0.80 +0.03 mm |
800 |
|
φ0.25±0.01 mm |
83.5 |
|
φ0.20±0.01 mm |
52 |
|
φ0.18±0.01 mm |
49 |
|
φ0.17±0.01 mm |
42 |
|
φ0.15±0.01 mm |
31 |
|
φ0.14±0.01 mm |
31 |
Standard Packaging
Each diamond‑wire spool is wrapped with moisture‑proof anti‑dust PE inner bag, sealed by vacuum packaging to avoid dust and moisture contamination. Sealed spools are placed into shock‑resistant hard paper cartons; foam fillers fill carton gaps to restrict spool displacement in transit. Multiple cartons are stacked onto ISPM‑15 fumigated wooden pallets, fixed by stretch wrap film. Outer pallet labels mark product grade, wire diameter, total length, batch number and gross‑net weight.
Shipping
We support FCL sea freight, LCL sea freight, air freight and express delivery, selected according to order total weight, volume and destination. Applicable trade terms contain EXW, FOB, CIF. Other terms may be available upon request. Shipping cost is calculated by cargo gross weight, volume, destination and selected transport mode.
Lead Time
Standard orders:15‑25 working days
Customized orders:25‑40 working days
Q1: What information do you need for a custom quotation of diamond wire?
A: Please provide target cutting material, required wire diameter, total length per spool, total order quantity and matching cutting‑machine tension range.
Q2: What is the sample and mass‑order lead time?
A: Standard stock orders take 15‑25 working days; customized specifications take 25‑40 working days after deposit confirmation.
Q3: What is your MOQ for diamond wire?
A: MOQ differs for different grades. Stone‑cutting diamond wire MOQ is 5 spools; magnetic‑material grade MOQ is10 spools. Small trial orders can be negotiated.
Q4: Can you make customized length for each spool?
A: Yes. Custom spool length is available, but minimum order quantity will rise for non‑standard length.
Q5: How do I select the correct diamond‑wire diameter for my workpiece?
A: For thin‑wafer slicing of magnetic materials or semiconductors, select 0.14‑0.25 mm thin‑diameter grade. For stone block cutting, select 0.40‑0.80 mm thick‑diameter grade. Also confirm maximum allowable tension of your cutting equipment before selection.
Q6: What is the difference between electroplated and resin‑bonded diamond wire?
A: Electroplated diamond wire uses nickel matrix to lock diamond grains, delivers higher cutting sharpness, fit for photovoltaic silicon‑wafer slicing. Resin‑bonded diamond wire owns multi‑layer diamond structure, produces smoother cutting surface, suitable for glass and ceramic processing.
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